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About Device Solution
Device Solution Division is continuously expanding its market share in DRAM and SRAM. Through early development and investment, it controls the high value-added product field of memory semiconductors, such as RAMBUS and DDR. By introducing the 512-Mb DDR DRAM to the memory market, SAMSUNG Electronics has firmly set itself as a leader in this field. In addition, stability has been achieved in the overall semiconductor business structure. It occurred due to expanding the system LSI business and strengthening system development capacity based on SOC (System on Chip) design.
- Electronics Engineering
- System-on-Chip Design
- Physics
- Materials Science
- Chemistry
- Computer Science
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| System LSI |
- System-on-Chip (SOC) Design Methodology, Audio-Visual Algorithms, DTV/STB Systems, Resistor-Transistor-Logic (RTL) Coding
- Device Drivers, API, Linux, pSOS, VxWorks, Middleware Graphics HARDWARE Acceleration, and Application Programming Interface Design
- CPU/OS Architectures, Microprocessor/DSP Architectures, Radio-Frequency Integrated Circuits (RFIC), and Transceivers
- Active and Passive Devices, Complementary Metal-Oxide Semiconductors (CMOS), Bipolar Complementary Metal-Oxide Semiconductors (BiCMOS), Orthogonal Frequency Division Multiplexing (OFDM) PHY BBP or DSSS PHY BBP, IEEE 802.11x MAC
- ARM-Processor-Based Design, MAC/PHY Interface, Embedded CPU Processors, Digital Communication System-on-Chip (SOC) Design
- Digital Video Disks (DVD), Digital Video Recording (DVR), MPEG2/4, Video Signal Processing, ARM/Calm Processors, Digital Signal Processing (DSP) Algorithms, Adaptive Differential Pulse-Code Modulation (ADPCM)
- Automatic Control Systems, Complementary Metal-Oxide Semiconductor (CMOS) Devices, SpecC, HARDWARE Design and Verification for Media Player Processor Design
- High Speed/Low Power Design, Mixed Signal Circuitry, Analog-to-Digital Converters (ADC), Digital-to-Analog Converters (DAC), CODEC, Phase-Locked Loop (PLL), ARM Embedded SOC
- Mobile Chip Sets, Networks, Media (CD-ROM, DVD, and LCD Monitors)
- Liquid-Crystal Display Driver Interface (LCD DDI), CCD, Card Information Systems (CIS), Smart Cards, FCC-Standard-Based Systems, and Multipoint Control Units (MCU)
- Capacitors, Shallow Junctions, Low-Temperature Dielectrics, High-k/SON, Epitaxial Growth, Micro-Electro-Mechanical Systems (MEMS)
- SONOS, Salicide, Thin Film, Image Sensor/RF/Module Design, Cooling Design, and Thermal Simulation
- Electrostatic Discharge (ESD) and Electromagnetic Interference (EMI) Latch-ups, Wafer-Level Processes, Bumping, and Encapsulation
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| Memory Division |
- Memory Design for DRAM (DDR, RDD, Graphic DRAM, Mobile DRAM), SRAM, and Flash (NAND/NOR)
- Semiconductor Process: Lithography, Etching, Diffusion, Thin Film, Control Microprocessors, Cleaning, Ion Implantation, and Metallization
- Device Modeling and Simulation, Device Physics, and Process Architecture
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| OMS Division |
- System Control Design and Hardware (Optical Pickup and Mechanical Control, Circuit Design, Firmware, EMI / EMC, Optical Disk Drive Development, and Firmware Design for Interfacing Computers)
- Optical Pickup Design Technology (Optical / Lens System Design, Actuator, and Component Technology)
- Optical Deck Mechanism Technology (Loading / Feeding Systems, Vibration / Noise Analysis, and Small Spindle / Sled Motor Development)
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| Storage Division |
- 3.5" HDD for Desktop Personal Computers
- Digital Video Recorders (DVR)
- Portable Video Recorders (PVR), such as MP3 Players
- 2.5" HDD for Notebooks and Personal Computers
- Mobile Applications
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| Device Packaging Center |
- Device Assembly, Quality Testing, Reliability Technologies
- Module Surface Mounting, and Module / Card / Material Process Technologies
- Module / Card / Material Testing, Equipment Technologies
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- Project Leader
- Researcher
- Chief Engineer
- Principal Engineer
- Research Engineer
- Development Engineer
- R&D Engineer
- Physicist
- Chip Designer
- System-on-Chip Designer
- Systems Engineer
- Automation Engineer
- Electronics Engineer
- Optics Engineer
- Optics Designer
- MEMS Engineer
- CMOS Engineer
- DSP Engineer
- SW Engineer
- SW Developer
- Production Engineer
- Chemical Engineer
- Chemist
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